LA P/818 20250425 20060101
B
24 B 37 08 A 20060101
B
24 B 49 10 A 20060101
B
24 B 49 16 A 20060101
H
01 L 21 304 A LA P/818 20200703 JP 2019-124851 20190703 TOYO KOHAN CO., LTD
18-1, Higashi-Gotanda 2 Chome, Shinagawa-ku, Tokyo 1418260 JAPAN JP
JP FUJII Hirofumi
c/o Kudamatsu Plant, Toyo Kohan Co., LTd., 1302-1, Higashitoyoi, Kudamatsu-shi, Yamaguchi, 7448611 JAPAN JP
KITAMOTO Hideo
c/o Kudamatsu Plant, Toyo Kohan Co., LTd., 1302-1, Higashitoyoi, Kudamatsu-shi, Yamaguchi, 7448611 JAPAN JP
SHIOMICHI Yukimasa
c/o Kudamatsu Plant, Toyo Kohan Co., LTd., 1302-1, Higashitoyoi, Kudamatsu-shi, Yamaguchi, 7448611 JAPAN JP
SUGIMURA OsaMU
c/o Kudamatsu Plant, Toyo Kohan Co., LTd., 1302-1, Higashitoyoi, Kudamatsu-shi, Yamaguchi, 7448611 JAPAN JP
Tilleke & Gibbins Lao Co., Ltd
No. 302, 3rd Floor, Vieng Vang Tower, Unit 15, Boulichan Road, Dongpalan Thong Village, Sisattanak District, Vientiane Capital, Lao PDR LA
CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE 301 20250425 20250425 20400703 JP PCT/JP/2020/026117 20200703 JP PCT/JP/2020/026117 20200703 JP WO/2021/002447 20210107 JP WO/2021/002447 20210107 20200703 20220110 20250425 20250425 Patent - PCT National Phase

<p>The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a method for producing a substrate with which it is possible to quickly control the flatness of a substrate with a high degree of precision by controlling polishing conditions. The present invention is a control system of a double-sided polishing device 10 that sandwiches a body W to be polished between an upper face plate 21 and a lower face plate 32 and that polishes a TOP surface 30a and a BOT surface 30b of the body W to be polished by causing the upper face plate and the lower face plate to rotate, wherein the control system is characterized in that: each of a TOP surface work amount PT (Ws) required in polishing of the TOP surface 30a, and a BOT surface work amount PB (Ws) required in polishing of the BOT surface 30b, are calculated; and polishing conditions are controlled so that the difference between the calculated TOP surface work amount PT and BOT surface work amount PB is kept within a prescribed range.</p>